EDA Design Page 3

DS SIMULIA CST Studio Suite 2026 SP2 CST Studio Suite 2025 builds on industry-leading simulation technology with a range of new features for the design, simulation and optimization of components and systems. New features include encrypted data sharing, the next generation of Perfect Boundary Approximation (PBA), full integration of the voxel body model poser, and the hybrid solver for bidirectional hybrid coupling between all the general purpose high-frequency solvers. The 2025 release is also available on the Dassault Systèmes 3DEXPERIENCE platform, allowing direct links to other design and simulation tools.These tools increase the agility of CST Studio Suite for modeling and simulating complex systems, and allow electromagnetic simulation to be applied in large projects spanning multiple departments and suppliers. Facilities...

Altium Designer 26.3.0 Altium Designeris an integrated computer-aided design (CAD) system for electronic equipment developed by the Australian company Altium. Previously, the same company developed P-CAD, which gained extraordinary popularity among Russian PCB designers. Altium Designer is a powerful system that allows you to implement electronic designs at the level of a circuit or program code, and then transfer information to an FPGA or printed circuit board. A distinctive feature of the program is the design structure and end-to-end integrity of development at different levels of design. In other words, design changes at the board level can be instantly transferred to the FPGA or circuit level and vice versa. Also, as a priority for the developers of this program, it...

Cadence JASPER 25.12 Cadence Jasper is a market-leading suite of Formal Verification tools within the Electronic Design Automation (EDA) industry. Its core function is to mathematically prove the correctness of a digital hardware design (at the Register-Transfer Level – RTL) against its specification, exhaustively and without the need for simulation testbenches. Product:Cadence JASPER 25.12 Lanaguage:english Platform:Linux/Macosx Size:2DVD

SYNOPSYS VC Formal 2025.06 Synopsys VC Formal is a comprehensive suite of formal verification applications built on a high-performance, scalable formal engine. It is designed to exhaustively prove the correctness of hardware designs (RTL) and system-level models without simulation, and is a core component of the Synopsys Verification Continuum®.  Core Value Proposition & Methodology VC Formal applies mathematical proof techniques to verify that a design satisfies its specified properties (assertions) under all possible input sequences and states. It is particularly powerful for: Exhaustive Block-Level Verification: Finding deep, corner-case bugs in control logic, arbiters, and finite state machines that are nearly impossible to hit with simulation. Automated Sign-off Checks: Running predefined, reusable apps to check for common design issues early in...

SYNOPSYS Verdi vx 2025.06 Synopsys Verdi is the industry-standard Automated Debug System for complex hardware design and verification. It is the central platform for understanding, analyzing, and debugging failures in simulation, emulation, and formal verification environments. Its core strength is its tight integration across the Synopsys Verification Continuum® (VCS®, ZeBu®, VC Formal®, etc.), providing a unified debug environment for all verification engines.  Core Value Proposition Verdi moves beyond basic waveform viewing. Its primary value is dramatically reducing debug time by automating the root-cause analysis of failures. It connects simulation results (logs, assertions, coverage) directly back to the source RTL, SystemVerilog, and UVM testbench code. Primary Capabilities & Features The Verdi platform encompasses several key technologies and applications:  Product:SYNOPSYS Verdi vx...

Mentor Graphics AMSV 2024 linux  Mentor Analog Mixed-Signal (AMS) Verification 2024 for Linux | Unified Verification Platform for Analog/Mixed-Signal ICs Mentor AMS Verification 2024 for Linux is a comprehensive, Linux-native verification platform for complex analog and mixed-signal integrated circuits. It combines fast SPICE simulation, analog behavioral modeling, and digital event-driven simulation in a unified environment to verify the interaction between analog and digital blocks efficiently. Core Functionality Overview: Unified Mixed-Signal Simulation Engine: Integrates the ELDO fine-grain parallel SPICE simulator with the Questa ADMS digital simulator, enabling accurate and fast co-simulation of transistor-level analog blocks with RTL or gate-level digital logic. Advanced Modeling & Verification Methodology: Supports real-number modeling (RNM), Verilog-AMS, and VHDL-AMS for creating abstract models of analog blocks, drastically...

Mentor Calypto SLEC 2024 Mentor Calypto SLEC 2024 | Sequential Logic Equivalence Checking & High-Level Synthesis Verification Platform Mentor Calypto SLEC 2024 is an advanced formal verification tool that performs sequential equivalence checking between RTL designs and their high-level synthesis (HLS) or SystemC/C++ source models. It mathematically proves functional equivalence across different levels of abstraction, crucial for verifying HLS and optimizing RTL implementations. Core Functionality Overview: Sequential Equivalence Checking for HLS Flows: Formally verifies that the generated RTL from a high-level synthesis tool (e.g., Catapult HLS) is functionally equivalent to the original C++/SystemC algorithmic source, even in the presence of complex sequential optimizations like pipelining and scheduling. Automatic Abstraction & Debug Environment: Automatically abstracts away implementation details (like timing, interfaces)...

Mentor Graphics onespin 2025  Mentor OneSpin 2025 | Advanced Formal Verification & Hardware Security Platform Mentor OneSpin 2025 is a comprehensive software suite for exhaustive formal verification, equivalence checking, and hardware security validation of semiconductor designs. It provides mathematical proof techniques to ensure functional correctness, identify security vulnerabilities, and guarantee design integrity beyond simulation-based testing. Core Functionality Overview: Exhaustive Formal Property Verification (FPV): Enables the formal proof of complex design properties and assertions to achieve 100% coverage for critical logic, identifying corner-case bugs unreachable by simulation. Advanced Equivalence & Security Checking: Performs exhaustive RTL-to-RTL and RTL-to-netlist equivalence checking, alongside dedicated tools for detecting hardware Trojans, side-channels, and other security vulnerabilities. Assertion Synthesis & IP Trust Verification: Automatically generates assertions from...

ARM Socrates 1.8.0 ARM Socrates 1.8.0 | FPGA & SoC Design & Implementation Platform ARM Socrates 1.8.0 is a comprehensive software platform for designing, implementing, and optimizing ARM-based FPGA and System-on-Chip (SoC) designs. It provides an integrated environment for configuring ARM processor subsystems, managing IP, and streamlining the hardware implementation flow into target FPGA devices. Core Functionality Overview: Graphical ARM Subsystem Configuration: Allows for the visual selection and configuration of ARM Cortex processor cores, interconnect (AMBA), peripherals, and memory controllers to build custom FPGA-optimized subsystems. IP Management & Design Assembly: Manages and integrates licensed ARM and third-party IP blocks, automates the generation of necessary interconnect logic, and outputs a complete hardware design (RTL) ready for synthesis. Flow Integration & Implementation...

Cadence Integrity 3D-IC 2025 Cadence Integrity 3D-IC | Platform for Multi-Die System Design, Analysis & Implementation Cadence Integrity 3D-IC is a comprehensive platform for the design, analysis, and implementation of complex 2.5D and 3D integrated circuit systems. It provides a unified environment to plan, integrate, and optimize multi-die systems, including chiplets, interposers, and advanced packaging technologies. Core Functionality Overview: System-Level Planning & Architectural Exploration: Allows for early floorplanning, partitioning, and thermal/power/performance trade-off analysis for multi-die systems before detailed implementation. Integrated Physical Design & Analysis: Manages the co-design of dies, interposers, and packages, integrating placement, routing, and 3D-aware analysis for signal integrity, power integrity, and thermal management. Chiplet & Advanced Packaging Integration: Supports heterogeneous integration of chiplets from different process nodes,...