EDA Design Page 5

Cadence QUANTUS 25.10 Cadence QUANTUS 25.10 (25.10.000) | 5.3 GbProduct:Cadence QUANTUS 25.10 Lanaguage:english Platform:Linux/Macosx Size:1DVD

Keysight RF Circuit Simulation Professional (Nexus) 2026 Keysight has released RF Circuit Simulation Professional (Nexus) 2026 Update 0.1 is the most advanced simulator and analysis solution for RF and millimeter wave design. Nexus unique simulation algorithms are optimized for the challenging demands of modern and complex designs, enabling full characterization of IPs prior to tape-out. RF Circuit Simulation Professional (Nexus) 2026 introduces a brand-new way to organize simulations with Nexus Connect, along with expanded analysis support (SSNA, TR, and Envelope with IQ file–modulated sources), a new optimizer (CMA-ES), and numerous user interface improvements, including a performance editor and variable sets. RF Circuit Simulation Professional (Nexus) 2026 Update 0.1 Release Notes Several bugs have been fixed in this minor update:Product:Keysight RF...

Sonnet Software Inc. announces the availability of the SONNET Suites Professional Release 19.54. This software provides commercial EDA software solutions for high-frequency RF/MW electromagnetic analysis. This version is a minor update to Sonnet version 19.52.2025. Below you will find a summary of the main improvements that are included in this version. New Improvements in Sonnet 19.54.2026 (release date June 2026) Product:SonnetSuite 19.54 Lanaguage:english Platform:Win/Linux Size:1DVD

Cadence SPECTRE 25.10 ISR9 Cadence Design Systems, Inc. has released SPECTRE 25.10 (054) is an advanced circuit simulator that simulates analog and digital circuits at the differential equation level. Spectre RF– Spectre RF Option in Virtuoso Studio RF: The Spectre RF Option is now integrated with Virtuoso Studio RF to allow design and verification of silicon and multi-fabric RF or microwave designs.– Load-Pull Analysis: With the integration of the load-pull analysis engine of Virtuoso Studio RF in Spectre RF, you can optimize RF and microwave designs with greater precision and efficiency.– Harmonic Balance Tuner: A new element, harm_tuner, has been added in rflib to support harmonic load-pull and harmonic source-pull analyses. harm_tuner is based on the Microwave Office hbtuner3 element...

Cadence OrCAD X Platform 2025.1 Cadence OrCAD X Platform 2025.1 ) | 10.8 Gb+4.9GProduct:Cadence OrCAD X Platform 2025.1 Lanaguage:english Platform:Win/Linux Size:2DVD

Synopsys Custom WaveView vY-2026.03 Synopsys Custom WaveView vY-2026.03 is the latest release of the industry's most powerful graphical waveform viewer and simulation post-processing tool for analog and mixed-signal IC design. Integrated with the Synopsys Galaxy Custom Designer platform, it provides high-performance data I/O, extensive mixed-signal analysis capabilities, and seamless cross-probing with schematic editors.Product:Synopsys Custom WaveView vY-2026.03 Lanaguage:english Platform:Win/Linux Size:1DVD

Synopsys Hspice vY-2026.03 Synopsys HSPICE vY-2026.03 is the latest release of the industry's gold-standard circuit simulator, trusted by semiconductor designers and foundries worldwide for accurate SPICE-level verification of analog, mixed-signal, and RF integrated circuits. As a cornerstone of the Synopsys Discovery AMS verification solution, it delivers unmatched accuracy for timing, power, and noise characterization across advanced process nodes.Product:Synopsys Hspice vY-2026.03 Lanaguage:english Platform:Win/Linux Size:1DVD

Mentor Graphics Tessent v2026.2 The available information highlights the following developments for the broader Tessent platform in 2026: New Product Introduction: Siemens EDA launched Tessent UltraSight, an end-to-end solution for system-level functional monitoring, debugging, and troubleshooting across the entire chip lifecycle . Industry Engagement: The 2026 Tessent User Conference in China featured new technologies like the industry's first automated DFT tool for analog circuits, Tessent AnalogTest . Technical Innovations: Siemens has integrated Tessent Embedded Analytics with Movellus Aeonic Insight to provide on-chip workload visibility and real-time voltage telemetry for improved silicon debugging and performance optimization . Training Restructuring: Siemens is streamlining its Tessent training courses in 2026, aiming to create more focused, up-to-date offerings based on user needs and integrated...

windpro  4.2.303  windPRO 4.2.303: Wind Energy Project Design Software windPRO 4.2.303 (Service Pack 3) is the latest version of EMD International's comprehensive software suite for the design, development, and assessment of wind energy projects . Released in March 2026, the version number 4.2.303 specifically refers to build 303 of the windPRO 4.2 service pack . Key Features in windPRO 4.2.303 windPRO 4.2 introduced significant improvements in GIS maps, curtailment optimization, project wizard, site screening with T-RIX Maps, and a new Ensemble Wake Model . The 4.2.303 Service Pack focuses on bug fixes and stability improvements across multiple modules . Core Capabilities  Product:windpro 4.2.303 Lanaguage:english Platform:Win7/WIN10 Size:1DVD

Keysight FR Circuit Simulation Professional (Nexus) 2026 Keysight RF Circuit Simulation Professional (Nexus) 2026 Nexus 2026 is Keysight‘s professional RF simulation software for designing complex RF and millimeter-wave circuits, 5G/6G components, and RFICs. It introduces workflow-based orchestration with visual whiteboarding and AI‑ready Python automation, running inside ADS, Cadence Virtuoso, and Synopsys Custom Compiler . Key New Features in 2026 Nexus Connect – Executable Design Whiteboard Visual flowchart‑based environment replicates the engineer‘s decision process. Users construct workflows on a drag‑and‑drop whiteboard or via auto‑generated Python scripts. Each step executes simulations, optimizations, and design decisions in sequence, supporting decision‑based loops and parameter settings. Workflows automatically generate structured data for AI/ML training and can be shared, reused, and redeployed across teams . Multi‑Domain...