Ansys.Additive.19.2.ANSYS Additive Suite delivers the critical insights required by designers, engineers and analysts to avoid build failure and create parts that accurately conform to design specifications. This comprehensive solution spans the entire workflow — from design for additive manufacturing (DfAM) through validation, print design, process simulation and exploration of materials.Product:Ansys.Additive.19.2 Lanaguage:english Platform:Win7/WIN8 Size:1DVD
ANSYS Electronics Suite 19.2ANSYS Inc. announced the availability of its leading provider of electromagnetic simulation software, ANSYS Electronics 19.1, contains both general purpose and application specific products to address a broad array of industry applications. These solutions allow you to accurately simulate electromagnetic fields when predicting the behaviour of electrical and electromechanical devices. ANSYS electronics solutions help you design innovative electrical and electronic products faster and more cost-effectively than ever before. Our industry leading electromagnetic field, circuit, systems and multiphysics simulation software fully automates the design process so you can better understand how your products behave. You can quickly optimize your design using simulation instead of wasting time building and testing costly prototypes. So whether it\’s a computer chip, a...
Cadence Conformal v15.20.100 Tools Having the right tools to design and verify your chips has never been more important. After all, you\’re trying to stay on top of Moore\’s Law and meet the design challenges that come with this. However, with electronic circuits being an integral component of so many products, design and verification also extends to packages, boards, and the whole system. To help you create high-quality, differentiated electronic products, Cadence offers a broad portfolio of tools to address an array of challenges related to custom IC, digital, IC package, and PCB design and system-level verification. Find the tools and methodologies you need to meet your power, performance, and area targets; overcome mixed-signal design constraints; achieve faster design closure;...
JMAG Designer 17.1 Solver Solver speed is directly related to model accuracy and reliability. Finite element analysis comes down to solving very large matrices. JSOL has developed advanced techniques to solve these matrices faster and produce more consistent results.JMAG users have some of the most advanced solver algorithms at their fingertips, and can be certain that JSOL will continue to adopt the latest calculation architecture within JMAG.Parallel Computing High speed processing and scalability are the two main goals of parallel processing.JMAG supports both shared and distributed memory processing and can incorporate the graphics processing unit (GPU) into calculations.From the desktop to clusters and cloud computing, JMAG’s parallelization technologies can be used in a wide range of environments. Utilizing these architectures...
Cadence MDV 18.03Metric-Driven Signoff is a unique Cadence methodology and technology for measuring and signing off on the design and verification metrics used during the many milestones typical in any integrated circuit (IC) development. While milestones and metrics vary by design type and end application, the final verification signoff will at, a minimum, contain the criteria and metrics within a flexible, human-readable, user-defined organizational structure. Automated data collection, project tracking, dashboards, and in-depth report techniques are mandatory elements to eliminate subjectivity, allowing engineers to spend more time on verification and less time manually collecting and organizing data.product:Cadence MDV 18.03 Lanaguage:english Platform:Linux/Macosx Size:1dvd
CGG Furgo Jason V9.7.3 Advanced Seismic Reservoir Characterization The advanced seismic reservoir characterization software products and workflows within the Jason Workbench yield timely answers to mitigate risk. Jason technology supports critical decisions for geoscientists and engineers to optimize well productivity, field development, and reservoir management. New capabilities for reservoir characterization now available in Jason 9.7.3 including better usability and performance, seamless connectivity with other GeoSoftware products and new functionality for Bayesian Facies classification and inversion analysis in FFP. Jason Workbench Products InverTracePlus RockTrace RockMod StatMod Anisotropic Inversion RockMC Depth Inversion Facies & Fluids Probabilities BodyChecking AVO Attribute Extraction Attribute Estimation Multi-Volume Attributes Multi-Attribute Well Interpolator RockFrame Environment-Plus (E-Plus) WellTie WaveletTools DepthMod FunctionMod Largo Multi-CPU Multi-Realization DownLink Product:CGG Furgo Jason V9.7.3...
Schlumberger omega 2017The Omega geophysical data processing platform integrates comprehensive workflows and advanced algorithms with leading science, scalable processing, and unparalleled flexibility to unleash the potential of your geophysics data. The Omega platform offers you powerful tools to transform your seismic, electromagnetic (EM), microseismic, or vertical seismic profile (VSP) data into intelligence you can use to reduce risks and increase your chances of success across the E&P life cycle. From the field to the final image, the Omega platform helps you better understand your critical subsurface challenges and make better decisions.Integration Extend geophysics data processing into reservoir modeling by integrating the Omega platform with the Petrel E&P software platform. You can iterate your workflows from processor to interpreter, connecting data...
Mentor Graphics Tessent 10.7 The Tessent® Product Suite The Tessent product suite provides comprehensive silicon test and yield analysis solutions that address the challenges of manufacturing test, debug, and yield ramp for today’s SoCs. Built on the foundation of the best-in-class solutions for each test discipline, Tessent brings them together in a powerful test flow that ensures total chip coverage.Tessent Product AreasAutomotive The rapid growth in automotive ICs has ushered in a new era in semiconductor test. Both device suppliers and integrators are scrambling to understand and define critical quality and reliability requirements and implementation solutions. Tessent Automotive can help.Logic Test Mentor Graphics offers the industry’s most powerful suite of logic test solutions with more than two decade of successful...
Cadence Xcelium v18.03.001 Linux Key Benefits Provides an average 2X improved single-core performance Offers an average multi-core performance speed-up of 3X for RTL design simulation, 5X for GLS, and 10X for DFT simulations running on today’s servers Provides parallelism with multi-core speed-up, benefiting event-dense simulation runs of all types Further extends innovation within the Cadence Verification Suite Support expands from x86 CPUs to include Arm-based servers Cadence® Xcelium™ Parallel Logic Simulation is the EDA industry’s first production-ready third-generation simulator. It is based on innovative multi-core parallel computing technology, enabling systems-on-chip (SoCs) to get to market faster than current solutions. On average, customers can achieve 2X improved single-core performance and more than 5X improved multi-core performance versus previous generation simulators. The...
FunctionBay Multi-Body Dynamics for ANSYS 19.1 Win64FunctionBay, Inc., a professional CAE company and provides MultiBody Dynamics (MBD) software, has released MBD for ANSYS 18.2 (Multi-Body Dynamics for ANSYS) is an add-on module for ANSYS that is used to simulate the transient behavior of a mechanical assembly in motion. About FunctionBay Multi-Body Dynamics (MBD) for ANSYS. MBD for ANSYS offers powerful Multi-Body Dynamic (MBD) analysis capabilities within the ANSYS Workbench environment. This allows ANSYS users to simulate the motion and all of the related physics of mechanical assemblies, enabling them to understand the behavior of their assemblies up-front and to generate the loads needed for component-level FEA. MBD for ANSYS also serves as a bridge to advanced MBD capabilities, by allowing...