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EDA Design Page 21

Synopsys laker v2023.09

Synopsys laker v2023.09 Laker Product:Synopsys laker v2023.09 Lanaguage:english Platform:Linux/Macosx Size:1DVD

Synopsys corebuilder v2023.09

Synopsys corebuilder v2023.09 for linux coreBuilder Product:Synopsys corebuilder v2023.09 Lanaguage:english Platform:Linux/Macosx Size:1DVD

Synopsys Testmax vV-2023.12

Synopsys Testmax vV-2023.12 Synopsys TestMAX Product:Synopsys Testmax vV-2023.12 Lanaguage:english Platform:Win7/WIN10 Size:1DVD

Synopsys primetime 2022.12

Synopsys primetime 2022.12 for linux The Golden Signoff Solution The PrimeTime® Suite delivers fast, memory-efficient scalar and multicore computing, distributed multi-scenario analysis and ECO fixing using POCV and variation-aware modeling. Synopsys' PrimeTime static timing analysis tool provides a single, golden, trusted signoff solution for timing, signal integrity, power and variation-aware analysis. Product:Synopsys primetime 2022.12 Lanaguage:english Platform:Linux/Macosx Size:1DVD

Synopsys Starrc vV-2023.12

Synopsys Starrc vV-2023.12  for linux StarRC Product:Synopsys Starrc vV-2023.12 Lanaguage:english Platform:Linux/Macosx Size:1DVD

Synopsys ESP vV2023.12

Synopsys ESP vV2023.12 Custom Design Formal Equivalence Checking Based on Symbolic Simulation ESP is a formal equivalence checking tool commonly used for full functional verification of custom designs such as embedded memories, custom macros, standard cells and I/O cell libraries. It is used to ensure that two design representations are functionally equivalent. These designs may be represented as Verilog behavioral model, RTL, Gate, Switch or SPICE or .db netlist views. Product:Synopsys ESP vV2023.12 Lanaguage: Platform:Linux/Macosx Size:1DVD

Synopsys Hspice vu-2023.03 sp2

Synopsys Hspice vu-2023.03 sp2 for linuxThe Gold Standard for Accurate Circuit Simulation As the ‘golden accuracy’ cornerstone of the PrimeSim™ solution, HSPICE®, now PrimeSim™ HSPICE® simulator, is seamlessly integrated with and empowered by other simulation engines in the continuum. PrimeSim HSPICE is the industry’s ‘gold standard’ for accurate circuit simulation and offers foundries-certified MOS device models with state-of-the-art simulation and analysis algorithms. With extensive usage in chip/package/board/backplane signal integrity simulation, cell and memory characterization, and analog mixed signal IC design, PrimeSim HSPICE is the industry’s most popular, trusted and comprehensive circuit simulator.  Product:Synopsys Hspice vu-2023.03 sp2 Lanaguage:english Platform:Linux/Macosx Size:2DVD

cammaster v11.24

cammaster v11.24PentaLogix's most complete CAM software designed to meet tomorrow's manufacturing needs. CAMMaster uses scripting, raster and contour based algorithms and increased ease-of-use to deliver the strongest PC-Based CAM system in the industry. We provide you a USB dongle. CAMMaster can be installed on multiple computers but will only run on a computer that has the dongle plugged in.Product:cammaster v11.24 Lanaguage:english Platform:Win7/WIN10 Size:1CD

Mentor Graphics Tessent 2024.1

Mentor Graphics Tessent 2024.1 Tessent Silicon Lifecycle Solutions Product:Mentor Graphics Tessent 2024.1 Lanaguage:english Platform:Linux/Macosx Size:1DVD

Keysight Physical Layer Test System (PLTS) 2024 U1

Keysight Physical Layer Test System (PLTS) 2024 U1What's New with PLTS 2024PCB Material Characterization Software ModuleNow calculate surface roughness (Rz) with PLTS N19308B optionHigh speed digital design challenges have become overwhelming due the signal loss as data transmits through ultra-fast PC boards. When so-called identical PCBs show different electrical performance, the problem can often be traced back to the fundamental PCB material properties themselves (namely copper surface loss and Dk/Df). By utilizing the new PLTS 2024 PCB Material Measurement software, signal integrity engineers can now extract valuable insights into the dielectric material properties. The bottom line is this: higher copper roughness impedes current flow and results in higher insertion loss. Material problems can now be uncovered by extracting this critical...