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Bentley AXSYS®.Engine V8i is a lifecycle database platform that fully integrates 2D schematics with a configurable data management environment for the definition and delivery of your own lifecycle solutions. By consolidating both graphic and non-graphic information into one central database, AXSYS®.Engine provides for accurate and consistent data across all disciplines and design documents. AXSYS®.Engine is the base environment used for the development of AXSYS®.Process and AXSYS®.Integrity and provides a common set of tools and facilities to both of these vertical applications. AXSYS®.Engine uses optimized, object-oriented technology to consolidate engineering schematic documents and project information into an integrated database environment.Product:Bentley AXSYS Engine V8i _08.11.11.22 Lanaguage:english Platform:WIN32&WIN64 Size:360 MB

The Gold Standard for Accurate Circuit Simulation HSPICE is the industry\’s \”gold standard\” for accurate circuit simulation and offers foundry-certified MOS device models with state-of-the-art simulation and analysis algorithms. With over 25 years of successful design tapeouts, HSPICE is the industry\’s most trusted and comprehensive circuit simulator. PDFHSPICE Datasheet For on chip simulation: Analog designs, RF design, custom digital design, standard cell design and characterization, memory design and characterization, and device model development. For off chip signal integrity simulation: Silicon to package to board to backplane analysis and simulation Design ChallengesAs IC geometries continue to shrink, the need for an accurate circuit simulator is critical. Designers require a highly accurate circuit simulator to precisely predict the timing, power consumption, functionality,...

FDTD Solutions Overview FDTD Solutions is a 3D Maxwell solver, capable of analyzing the interaction of UV, visible, and IR radiation with complicated structures employing wavelength scale features. FDTD Solutions is able to accurately take into account material dispersion over wide wavelength ranges via its proprietary Multi-coefficient Material modeling capabilities, enabling the end user to efficiently calculate device response over wide bandwidths. With a highly-optimized computational engine able to exploit multi-core computing systems in everything from laptops to high-performance computing clusters, and a built-in optimization framework to speed the generation of optimized nanophotonics devices, FDTD Solutions is the photonics design environment of choice among industry professionals.Key Benefits of FDTD Solutions Decreased product development costs via highly-accurate algorithms with built-in optimization...

Precision Synthesis offers high quality of results, industry-unique features, and integration across Mentor Graphics’ FPGA Flow– the industry’s most comprehensive FPGA vendor independent solution.FPGA Synthesis Product Suite Precision RTL Plus Offers breakthrough advantages for both commercial applications and for mil-aero and safety-critical systems. Features include multi-vendor physical synthesis, incremental flows, low power synthesis, and IEEE-based encryption, and more. Precision RTL Plus + LeonardoSpectrum A single product to access both Precision RTL Plus and LeonardoSpectrum, Precision RTL Plus + Leo Station is an ideal upgrade for existing LeonardoSpectrum users. Precision RTL Offers an intuitive environment with advanced synthesis optimizations to deliver superior quality of results, award-winning analysis to eliminate defects, and advanced operator inference to enable FPGA vendor-independent design. Precision Physical...

PAM-STAMP 2G is a complete, integrated, scalable and streamlined stamping solution. It covers the entire tooling process from quotation and die design through formability and try-out validation, including springback prediction and correction. It provides solutions-oriented tools for Automotive, Aerospace, and General stamping processes.is a complete, integrated, scalable and streamlined stamping solution. It covers the entire tooling process from quotation and die design through formability and try-out validation, including springback prediction and correction. It provides solutions-oriented tools for Automotive, Aerospace, and General stamping processes. PAM-STAMP 2G allows users to make decisions online, bringing together the design engineer, the material provider, the die designer and the try-out press shop from an early stage of the design right through to production. This web-enabled...

Unique, Efficient FoundationThe inherent completeness of 3D point clouds represents one of their major advantages over other sources of geometric information. Cyclone’s unique Object Database Client/Server software architecture provides the highest performance environment for laser scanning projects. Cyclone software makes it easy for users to manage data efficiently in databases. Users can work concurrently on databases, thereby reducing the need to copy and/or transmit large point cloud project files. Cyclone Modules for Flexible ConfigurationLeica Cyclone is comprised of individual software modules for different needs and for flexible product customization. Cyclone-SCANCyclone-SCAN is the software interface for operating the Leica scanners from a laptop in the field. This includes all Leica legacy scanners as well as the current ScanStation C10 (excluding the...

What’s In This ReleaseThe LithoTect® 5000.0.1.2 software release is a patch release providing bug fixes forthe 5000.0.1.1 release.The LithoTect® software uses Landmark’s Application Manager (LAM) product licensing system. The LAM license system is based on Macrovision’s FLEXnet Publisher’s product. Please refer to the LAM Guide – Linux, Solaris and Windows for complete details.If you currently have access to the Landmark R5000.0.8 OpenWorks database, you will be able to directly import section and volume-based horizons, faults, and seismic, and wells (wellheads, attributes, deviations, and logs). Please refer to the LithoTect application Help menus for information on the OpenWorks import functionality.To go directly to the bug fixes and known issues for the 5000.0.1.2 release, click on the blue links below:Fixed IssuesKnown IssuesIntroductionLithoTect...

ANSYS SIwave V7.0 software analyzes the printed circuit boards (PCBs) and IC packages prevalent in modern electronic products. This includes packages merged onto boards for complete channel analysis. The tool allows you to perform complete signal- and power- integrity analyses from DC to beyond 10 Gb/s. SIwave extracts frequency-dependent circuit models of signal nets and power distribution networks directly from electrical CAD layout (ECAD) databases. These analyses aid in the identification of signal- and power-integrity problems and are critical to designers seeking first-pass system success. Entire design paths from package to board to package can be analyzed using a full-wave electromagnetic simulator that realizes coupling effects between packages and boards that are often ignored. With the IC die network modeler,...

PAM-STAMP 2G v2012 is a complete, integrated, scalable and streamlined stamping solution. It covers the entire tooling process from quotation and die design through formability and try-out validation, including springback prediction and correction. It provides solutions-oriented tools for Automotive, Aerospace, and General stamping processes.Alt TextPAM-STAMP 2G online! PAM-STAMP 2G allows users to make decisions online, bringing together the design engineer, the material provider, the die designer and the try-out press shop from an early stage of the design right through to production. This web-enabled technology allows images, annotation, text and 3D, models to be shared, thus supporting a truly collaborative engineering environment.PAM-INVERSE: Blank shape prediction Designed to make a very rapid assessment of a part shape, and to provide a...

209536 Draft feature is not highlighted in FeatureManager when selcted from graphics area346012 Need feature scope support for ModelDoc2::InsertCutSurface and SurfaceCutFeatureData464195 AddItemNotify not fired when a sketch is added519376 Opening part using a BOM opens last saved configuration instead of the one used in the drawing view521518 Adding board cut-outs using additional Board_Outline features does not work correctly, material is added rather than removed533223 Develop a tool to compare results from different flow runs easily556312 Crop and detail view of exploded state assembly does not display correctly (part of the assembly is cut) when displayed in shaded mode564852 Adding prefix to Pack and Go does not update linked equation reference568267 Delete view in view orientation window on drawing not possible569854...