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Bentley MXROAD Suite combines all of the power of MXROAD (an advanced, string-based modeling tool for new design of all road types) together with PowerSurvey (an all-in-one, standalone survey solution), MXRENEW (a complimentary solution that fits new design onto existing roads for rehabilitation and reconstruction), and MXURBAN (parametric design software for roads in cities and urban areas). MXROAD Suite includes the ability to quickly create new design alternatives for any type of scheme in order to achieve the ideal road system. Upon selection of the final design alternative, MXROAD Suite automates much of the design detailing process, saving you time and money.Product:Bentley MX V8i International v08.11.07.536 Lanaguage:english Platform:Winxp/Win7 Size:

AutoCAD Plant 3D – a powerful tool for the design of technological facilities, as well as to create a digital prototype of an existing or new facility. AutoCAD Plant 3D, based on the latest version of the AutoCAD, provides the most modern means of three-dimensional design. In AutoCAD Plant 3D integrated AutoCAD P & ID, which allows you to reconcile data circuits and three-dimensional models. Prompt receipt of two-dimensional and isometric drawings and other documents, convenient system access and management can increase productivity and improve accuracy of design.Product:Autodesk Autocad Plant 3D 2014 Lanaguage:Multi Language Platform:WIN32&WIN64 Size:2DVD

VoluMill NEXION is the next generation of VoluMill Universal. It contains major enhancements to virtually every area of the product, from performance, to graphics, to the user interface, many of which are direct responses to input from our valued customers. Redesigned Toolpath Manager NEW Verification Technology NEW Layer Support Improved Graphics 64-bit Processor Support Toolpath Improvements Improved Rest-Milling Improved Geometry Selection New Assembly Support for STEP Files Improved predictability when chaining boundaries Improved Cylindrical Body support Thumbnail support File Merge consolidated into the File Open dialog as a checkbox optionProduct:VoluMill NEXION v5.5.0.1740 Lanaguage:english Platform:WIN32&WIN64 Size:1CD

HTRI Xchanger Suite, the most advanced tool for the design, rating, and simulation of heat exchangers, brings our rigorous research to end users in an integrated graphical environment. With the addition of our latest component—Xspe—HTRI’s premier technology and expertise are available in a full complement of products for all your engineering needs. HTRI Xchanger Suite components share many common features.Supporting Data Since 1962, HTRI has collected and analyzed data from industrial-sized units. These data have been used to develop the methods and correlations integral to our software. Heat transfer and pressure drop correlations are continually reviewed and updated as part of our ongoing research program. A partial list of HTRI data banks follows: high-finned tubes shellside single-phase shellside flow boiling...

Key components: Integrated development environment with project management tools and editor Highly optimizing C and C++ compiler for ARM Automatic checking of MISRA C rules (MISRA C:2004) ARM EABI and CMSIS compliance Extensive HW target system support Optional I-jet and JTAGjet-Trace in-curcuit debugging probes Power debugging to visualize power consumption in correlation with source code Run-time libraries including source code Relocating ARM assembler Linker and librarian tools C-SPY® debugger with ARM simulator, JTAG support and support for RTOS-aware debugging on hardware RTOS plugins available from IAR Systems and RTOS vendors Over 3100 sample projects for evaluation boards from many different manufacturers User and reference guides in PDF format Context-sensitive online help Chip-specific support: Over 3100 example projects for evaluation boards...

Move Structural Modelling and Analysis Software is the most complete structural modelling and analysis toolkit available providing a full digital environment for best practice structural modelling to reduce risk and uncertainty in geological models across oil & gas E&P, mineral resource development, CO2 and rad-waste storage and geo-technical projects. The Move Suite provides dedicated products for digital field mapping, cross-section construction, 3D model building, kinematic restoration and validation, geomechanical modelling, fracture modelling and sediment modelling. The software has been designed by geologists for geologists, meaning it stays true to geological principles to create valid geological models. With the ability to test scenarios and to model geological evolution, Move reduces uncertainty by going beyond static models which may be little more...

DescriptionDRP is not a design program for various devices, but is a device rating tool. It should be noted, however, a user with sufficient technical background can use the program as a design tool. In contrast to the previous FRI rating programs that were either a single device, single process (individual device programs) or single process, multiple device (FRI Tray program), DRP is a multiple process, multiple device program. As such, the users can use a single process stream and rate multiple devices side-by-side, or have multiple processes and rate them with one device and view the results side-by-side. The program allows the user to import input data from various process simulators, using XML format.product:FRI.Device.Rating.Program.V2.2.3.700 Lanaguage:english Platform:Winxp/Win7 Size:8 MB

ANSYS Q3D Extractor software is the premier 3-D and 2-D parasitic extraction tool for engineers designing electronic packaging and power electronic equipment. Q3D Extractor uses method of moments (integral equations) and FEMs to compute capacitive, conductance, inductance and resistance matrices. It uses the fast multipole method (FMM) to accelerate the solution of the integral equations. Outputs from the solver include current and voltage distributions, CG and RL matrices. View larger image Q3D Extractor efficiently performs 3-D and 2-D electromagnetic field simulation required for the extraction of resistance, conductance, partial inductance and capacitance RLCG parameters from a design and automatically generates a netlist in many formats, including SML (ANSYS Simplorer format) and SPICE. Q3D Extractor is capable of generating S-parameters exported...

MagNet v72D/3D ELECTROMAGNETIC FIELD SIMULATION SOFTWAREPREDICTING PERFORMANCE FOR BETTER DESIGNS MagNet v7 2D/3D simulation software for electromagnetic fields let\’s you rapidly model and predict the performance of any electromagnetic or electromechanical device: Electric Motors/Generators Magnetic Levitation Transformers Actuators Sensors/NDT Induction Heating Loudspeakers Magnetic Recording Heads MRI Transcranial Magnetic Simulations MagNet uses the finite element technique for an accurate and quick solution of Maxwell\’s equations. Each module is tailored to simulate different types of electromagnetic fields and is available separately for both 2D & 3D designs. Transient or Time-varying electromagnetic fields Non-linear analysis Second-order time stepping Resume Feature: pause at a particular time step for inspection Core losses, proximity effects and eddy currents Motion Supports rotational, linear and general (multiple degrees...

OptimizePI enables design teams to balance decoupling capacitor (decap) cost and performance for printed circuit boards (PCBs) and IC packages. Decap costs savings of 15% to 50% are typical. High performance is analytically assured for the power delivery system (PDS) at both a system and component level. OptimizePI is built on proven Sigrity hybrid electromagnetic circuit analysis technology in combination with our unique optimization engine to quickly pinpoint the best possible decap selections and placement locations. OptimizePI Data Sheet in PDF format OptimizePI Applications: Automatically selecting and placing decoupling capacitors Eliminating decap over-design for printed circuit boards and IC packages Reducing PDS cost for new designs and post-production products Developing effective decap guidelines for packaged components Recapturing design area by...