Fluent PakSi-TM 1.4.7
The trend toward smaller device geometries has increased IC functionality and speed. With smaller dies, heat dissipation and the thermal characteristics of the package play a significant role in chip reliability. More and more the critical factor in determining IC reliability is not the IC itself but the package. At the system level reliability depends on matching the thermal expansion properties ofthe die, interconnects, package, and the PWB to avoid thermal differential expansion due to internal or external temperature changes.Package engineers must also consider thermal and mechanical stresses associated with the manufacturing process in order to reduceany manufacturing induced defects. During the solder re-flow operation temperatures in excess of 220°C are realized. This high temperature, combined with moisture absorption in...