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::::::English Description:::::: Since 1981, the Industry’s standard and choice of consulting engineers worldwide for an easy-to-use, efficient, and reliable production tool. This software is based on the proven Equivalent Frame Technology and  features the following modeling, analysis and design  capabilities:       Modeling Capabilities           o Project parameters entered using easy to learn and use design wizard           o Bonded (grouted) and unbonded post-tensioning           o One-way and two-way floor systems and beam frames              o Multiple beam cross-sections: rectangular, T, L  and I               o Drop caps, drop panels, steps above and below  the slab            o 3D solid model viewer for visual verification of input geometry           o Imports input data for design strip from ADAPT- Builder suite of programs       Analysis Capabilities           o Equivalent frame or simple...

The GRASP9 software is the most versatile tool available for analysing general reflector antennas and antenna farms. The package is a general tool to handle single, dual and multi-reflector configurations (beam waveguides). GRASP9 can calculate the electromagnetic radiation from systems consisting of multiple reflectors with several feeds and feed arrays. It is even possible to analyse the interaction between various antenna systems, a requirement which is often encountered in satellite systems where several antennas may be mounted in the vicinity of each other. The scattering from a feed or from a reflector of one system in a reflector of another system can thus easily be calculated. A vast amount of different surfaces, including user-defined shapes, can be analysed, just as...

In today’s complex product development and manufacturing environment, designers and engineers are using a wide range of software tools to design and simulate their products. Often, chained simulation process flows are required in which the parameters and results from one software package are needed as inputs to another package and the manual process of entering the required data can reduce efficiency, slow product development, and introduce errors in modeling and simulation assumptions. SIMULIA provides market-leading solutions that improve the process of leveraging the power of various software packages. Isight and the SIMULIA Execution Engine (formerly Fiper) are used to combine multiple cross-disciplinary models and applications together in a simulation process flow, automate their execution across distributed compute resources, explore the...

::::::English Description:::::: Silvaco TCAD Linux  tools start with understanding the physics of the basic semiconductor, dielectric, and conducting materials. The Virtual Wafer Fab technology simulation environment enables the ATHENA process technology simulators and the ATLAS device technology simulators to prepare, run, optimize, and analyze semiconductor experiments to achieve optimal process recipes and device targets. Product:Silvaco TCAD 2006.03 Linux Lanaguage:english Platform:Winxp/Win7 Size:323MB

::::::English Description:::::: Super Finsim is the best choice for large Verilog simulation capacity. It offers an excellent price/performance ratio and robust integration with third party software. Features: Best choice for large farms for Verilog simulation Supports the entire Verilog language, user defined primitives, specify blocks, system tasks and functions, PLI 1.0, VCD and SDF. Supports compiled, interpreted, and any mixture of compiled and interpreted simulation First mixed event and cycle driven simulator for Verilog Smart partitioner analyzes the design and decides which areas can be simulated by the Enhanced Cycle Simulation (ECS) kernel Able to handle modules with path delays as well as some RTL-level modules, and fully supports Xs and Zs as well as the entire range of Verilog...

About IC-CAPIC-CAP (integrated circuitcharacterization and analysisprogram) is device modelingsoftware that provides powerfulcharacterization and analysiscapabilities for today’s semiconduc-tor modeling. IC-CAP offers deviceengineers and designers a state-of-the-art modeling tool that fillsnumerous modeling needs, includ-ing instrument control, data acquisi-tion, parameter extraction, graphicalanalysis, simulation, optimization,and statistical analysis. All of thesecapabilities are combined in aflexible, automated, and intuitivesoftware environment for efficientand accurate extraction of activedevices and circuit model param-eters. IC-CAP provides the power tobuild model libraries for AdvancedDesign System (ADS) or other com-mercial simulators.Features at a glance• complete automated hardware and• efficient, open and flexible softwaresoftware integrationenvironment and extraction• fast links to ADS simulatorsmethodologies• unique boundary models for realistic• DC to RF extraction routines forworst-case modelingstate-of-the-art industry standard models• worldwide training and support• unique nonlinear...

p> ::::::English Description:::::: VariCAD 2007 v3.00 Linux Rpm package is a 3D/2D CAD system for mechanical engineering. In addition to standard tools for 3D modeling and 2D drafting, the CAD system provides tools for sheet metal unbending and crash tests, assembly support, libraries of standard mechanical parts (ANSI, DIN) and symbols, mechanical part calculations and tools for working with bills of materials (BOM) and title blocks. VariCAD supports STEP, STL, IGES, DWG and DXF file formats. The comprehensive CAD software enables designers to quickly create, evaluate, and modify their models. It is compact, fast, easy to use, and provides everything one needs for mechanical design. The CAD system is sold fully loaded, including all features and functions, for one affordable...

The trend toward smaller device geometries has increased IC functionality and speed. With smaller dies, heat dissipation and the thermal characteristics of the package play a significant role in chip reliability. More and more the critical factor in determining IC reliability is not the IC itself but the package. At the system level reliability depends on matching the thermal expansion properties ofthe die, interconnects, package, and the PWB to avoid thermal differential expansion due to internal or external temperature changes.Package engineers must also consider thermal and mechanical stresses associated with the manufacturing process in order to reduceany manufacturing induced defects. During the solder re-flow operation temperatures in excess of 220°C are realized. This high temperature, combined with moisture absorption in...

::::::English Description:::::: PakSi-E is a versatile 3D quasi-static electromagnetic simulation tool for electronic packaging. With this userfriendly tool, engineers and designers can address and resolve electrical performance issues in their IC packaging designs in a timely manner. PakSi-E is the only 3D quasi-static extraction tool on the market that provides whole package RLGC parasitic extractions. As shown in the above figure, small features like wires, vias, solder balls and pads must be modeled in a 3D model to generate accurate high requency SPICE subcircuits.Even though 3D modeling is essential to high frequency simulation, many competing products on the market still use the less accurate 2D or 2.5D for whole package extraction because of the technical challenges associated with 3D modeling. With...

::::::English Description:::::: National Instruments is a leading machine vision and scientific imaging hardware and software tools provider.  From inspecting automotive parts to researching advanced medicines, engineers and scientists use NI vision software and hardware to solve a diverse set of application challenges, faster and at a lower cost.Product:NI Vision 8.5 Run Time Engine Lanaguage:english Platform:Winxp/Win7 Size:32MB