Professional Software Archive

CFTurbo 10.3.5.742 Win64Product:CFTurbo 10.3.5.742 Win64 Lanaguage:english Platform:Win7/WIN8 Size:1CD

OneCNC.XR7 CAD/CAM (computer-aided design and computer-aided manufacturing) refers to computer software that is used to both design and manufacture products. CAD is the use of computer technology for design and design documentation. CAD/CAM applications are used to both design a product and program manufacturing processes, specifically, CNC machining. CAM software uses the models and assemblies created in CAD software to generate tool paths that drive the machines that turn the designs into physical parts. CAD/CAM software is most often used for machining of prototypes and finished production parts. DownLink Product:OneCNC.XR7 Lanaguage:english Platform:Win7/WIN10 Size:1CD

CAESES FRIENDSHIP-Framework 4.3.1FRIENDSHIP SYSTEMS released a new maintenance version of the CAD and optimization platform CAESES. With CAESES we strive to provide you with the most robust and reliable CAD solution for automated simulation studies.Product:CAESES FRIENDSHIP-Framework 4.3.1 Lanaguage:english Platform:Win7/WIN8 Size:1CD

JMAG Designer 17.1 Solver Solver speed is directly related to model accuracy and reliability. Finite element analysis comes down to solving very large matrices. JSOL has developed advanced techniques to solve these matrices faster and produce more consistent results.JMAG users have some of the most advanced solver algorithms at their fingertips, and can be certain that JSOL will continue to adopt the latest calculation architecture within JMAG.Parallel Computing High speed processing and scalability are the two main goals of parallel processing.JMAG supports both shared and distributed memory processing and can incorporate the graphics processing unit (GPU) into calculations.From the desktop to clusters and cloud computing, JMAG’s parallelization technologies can be used in a wide range of environments. Utilizing these architectures...

Infolytica ThermNet 7.8ThermNet simulates the steady-state and transient temperature distribution of specified heat sources. Coupling with MagNet and ElecNet provides accurate electro-thermal analysis for devices such as electric machines (motors and generators), transformers, induction heating, surge arrestors and dielectric heating.–Simulates the temperature distributions caused by specified heat sources in the presence of thermally conducting materials–Coupling with MagNet for heating effects due to eddy current and hysteresis losses in the magnetic system–Coupling with ElecNet for heating effects due to electric lossesProduct:Infolytica ThermNet 7.8 Lanaguage:english Platform:Win7/WIN8 Size:1CD

Infolytica MotorSolve 6.1.0.9 x64Motor designers can rapidly simulate and get machine performance characteristics using MotorSolve, the powerful software that offers their complete analysis needs in one design environment.The template-based interface combined with the variational geometry modeling makes the software easy to use yet flexible enough to handle virtually any motor design. Rotor and stator geometries can also be directly imported. MotorSolve user interface version 5MotorSolve simulates machine performance using an automated finite element analysis engine. There is no need to construct the model, perform mesh refinements and extensive post-processing to extract motor related results. MotorSolve performs these operations for the user.Need to do a quick initial design check? Validating your final spec? Or somewhere in between? Choose from several analysis...

Coventor SEMulator3D 7.0Coventor SEMulator3D 7.0 – the newest version of its semiconductor virtual fabrication platform. With added features, performance improvements, and a new Device Analysis capability, SEMulator3D 7.0 addresses both process and device simulation while lowering the barriers to advanced semiconductor technology development. The new Device Analysis capability enables seamless understanding of how process changes, process variability, and integration schemes directly impact transistor device performance. SEMulator3D Device Analysis The new Device Analysis capability can extract electrical characteristics of a transistor and explore process variability on device operation, all directly within SEMulator3D. Designers can generate transistor IV curves and perform automatic device parameter extraction from those curves. Transistor performance can be measured across changes in patterning, lithography, etch, deposition, and other...

Cadence Spectre 17.10 LinuxCadence Spectre Circuit Simulator provides fast, accurate SPICE-level simulation for analog, radio frequency (RF), and mixed-signal circuits. It is tightly integrated with the Cadence Virtuoso® custom design platform and provides detailed transistor-level analysis in multiple domains. Its superior architecture allows for low memory consumption and high-capacity analysis. Features– Provides high-performance, high-capacity SPICE-level analog and RF simulation out of the box for accuracy and convergence– Enable the tradeoff between accuracy and performance through user-friendly simulation setup applicable to the most complex analog and custom-digital ICs– Uses the +postlayout option to provide efficient post-layout simulation with RLCK parasitics– Utilizes efficient multi-threaded technology to improve simulation throughput– Simulates distributed components modeled using S-parameter models (n-port) and lossy coupled transmission line...

Cadence MDV 18.03Metric-Driven Signoff is a unique Cadence methodology and technology for measuring and signing off on the design and verification metrics used during the many milestones typical in any integrated circuit (IC) development. While milestones and metrics vary by design type and end application, the final verification signoff will at, a minimum, contain the criteria and metrics within a flexible, human-readable, user-defined organizational structure. Automated data collection, project tracking, dashboards, and in-depth report techniques are mandatory elements to eliminate subjectivity, allowing engineers to spend more time on verification and less time manually collecting and organizing data.product:Cadence MDV 18.03 Lanaguage:english Platform:Linux/Macosx Size:1dvd

Cadence INCISIVECadence Design Systems, Inc., a leader in global electronic design innovation, introduced its leading functional verification platform and methodologies, INCISIVE 15.20.As electronic products across all market segments become more sophisticated, developing their underlying hardware and software, and integrating the two sides, continues to grow more complex. Early software development, hardware verification, hardware/software integration, and integrated system validation have become primary challenges, increasing development costs, project schedules, and risks.Using the Cadence Verification Suite, you can reduce system integration time by up to 50%, accelerating intellectual property (IP) development, system-on-chip (SoC) integration, and concurrent hardware/software development. This verification suite is comprised of core engines, verification fabric technologies, and solutions spanning these technologies, as shown in Figure 1.Core engines include JasperGold formal...