Professional Software Archive

AutoCAD Plant 3D – a powerful tool for the design of technological facilities, as well as to create a digital prototype of an existing or new facility. AutoCAD Plant 3D, based on the latest version of the AutoCAD, provides the most modern means of three-dimensional design. In AutoCAD Plant 3D integrated AutoCAD P & ID, which allows you to reconcile data circuits and three-dimensional models. Prompt receipt of two-dimensional and isometric drawings and other documents, convenient system access and management can increase productivity and improve accuracy of design.Product:Autodesk Autocad Plant 3D 2014 Lanaguage:Multi Language Platform:WIN32&WIN64 Size:2DVD

VoluMill NEXION is the next generation of VoluMill Universal. It contains major enhancements to virtually every area of the product, from performance, to graphics, to the user interface, many of which are direct responses to input from our valued customers. Redesigned Toolpath Manager NEW Verification Technology NEW Layer Support Improved Graphics 64-bit Processor Support Toolpath Improvements Improved Rest-Milling Improved Geometry Selection New Assembly Support for STEP Files Improved predictability when chaining boundaries Improved Cylindrical Body support Thumbnail support File Merge consolidated into the File Open dialog as a checkbox optionProduct:VoluMill NEXION v5.5.0.1740 Lanaguage:english Platform:WIN32&WIN64 Size:1CD

HTRI Xchanger Suite, the most advanced tool for the design, rating, and simulation of heat exchangers, brings our rigorous research to end users in an integrated graphical environment. With the addition of our latest component—Xspe—HTRI’s premier technology and expertise are available in a full complement of products for all your engineering needs. HTRI Xchanger Suite components share many common features.Supporting Data Since 1962, HTRI has collected and analyzed data from industrial-sized units. These data have been used to develop the methods and correlations integral to our software. Heat transfer and pressure drop correlations are continually reviewed and updated as part of our ongoing research program. A partial list of HTRI data banks follows: high-finned tubes shellside single-phase shellside flow boiling...

OLGA is used in feasibility studies, conceptual studies, FEED and detailed designs and is essential for defining operating procedures and control schemes. Application examples: Transient thermohydraulics during start-up/shut-in Optimal design for maximum operating envelope Process and control system design Flow assurance, investigating hydrates, wax, asphaltenes, corrosion, emulsions, scale and sand Liquid inventory during pigging and rate changes Slug mitigation and control Fluid systems that can be modelled: Oil and natural gas flowlines Wet gas and condensate flowlines Wellstream fluids Dense phase flowlines Single phase gas or liquid flowlines Laboratory experiments Full network capability OLGA has full network capability, allowing for definition of converging and diverging transport and process networks as well as closed loops. This flexibility enables the engineers to...

RG will issue a major update and release of both NozzlePRO and FE/Pipe (and all bundled programs) in March of 2013. This release will include new functionality, significant enhancements to current functionality, and imrpoved GUIs. To see a summary of the new features that will be included in this release, please see the flyer we have prepared by clicking HERE. PRG will be conducting FEA Training seminars in both Houston and Calgary in April. Please review our training seminars page as the dates have changed! For more information, please go to the Training Seminars page by clicking on the navigation menu on the left side of this page, or by clicking HERE.FEA Technology for Rapid Modeling and Stress Analysis of...

ANSYS HFSS software is the industry-standard simulation tool for 3-D full-wave electromagnetic field simulation and is essential for the design of high-frequency and high-speed component design. HFSS offers multiple state-of the-art solver technologies based on either the proven finite element method or the well established integral equation method. You can select the appropriate solver for the type of simulation you are performing. View larger image Electric field distribution with a far field radiation pattern simulated by the new finite antenna array capability in HFSS Engineers rely on the accuracy, capacity, and performance of HFSS to design high-speed components including on-chip embedded passives, IC packages, PCB interconnects and high-frequency components such as antennas, RF/microwave components and biomedical devices. With HFSS, engineers...

Ansoft Designer 8 with Nexxim 8 OverviewMultiple Analysis domainsTime and Frequency consistencyHigh speed & capacityTransistor-level accuracyNative supportHSpice netlists & design kitsSpectre/SpectreRF netlists & design kitsIBIS v4.0 & Verilog-ASuperior S-Parameter HandlingState-Space and ConvolutionBenchmarked 660 ports!Mixed port impedancesFlexibility in design flow and integrationAnsoft DesignerCo-simulation with Ansoft EMCadence ADEMultiple output/viewing formatsproduct:Ansoft Designer&Nexxim 8.0 Lanaguage:english Platform:WIN32&WIN64 Size:1CD

ANSYS TPA ANSYS Turbo Package Analyzer (TPA) software provides the package extraction and automation capability needed to address the electrical requirements of today\’s complex high-performance SiP, chip-scale, flip-chip, ball-grid array and wirebond. With TPA, IC and package designers of analog/RF and high-speed digital applications can fully characterize an entire package structure and automatically extract lumped or distributed RLC values for use with ANSYS DesignerSI or alternative SPICE-compatible tools to perform subsequent transient analyses, such as crosstalk, overshoot and TDR. TPA further enables the prediction of IC package performance and compatibility, facilitating performance trade-off analysis before a design is committed to fabrication. TPA couples with leading electronic package layout tools to accurately model package interconnect elements, such as nonorthogonal traces, vias,...

Key components: Integrated development environment with project management tools and editor Highly optimizing C and C++ compiler for ARM Automatic checking of MISRA C rules (MISRA C:2004) ARM EABI and CMSIS compliance Extensive HW target system support Optional I-jet and JTAGjet-Trace in-curcuit debugging probes Power debugging to visualize power consumption in correlation with source code Run-time libraries including source code Relocating ARM assembler Linker and librarian tools C-SPY® debugger with ARM simulator, JTAG support and support for RTOS-aware debugging on hardware RTOS plugins available from IAR Systems and RTOS vendors Over 3100 sample projects for evaluation boards from many different manufacturers User and reference guides in PDF format Context-sensitive online help Chip-specific support: Over 3100 example projects for evaluation boards...

imulayt brings powerful fiber simulation capabilities proven over the past 15 years to the CATIA Composites Design solutions. With complete integration in the CATIA V5/V6 environment, the Advanced Fiber Modeler (AFM) provides immediate access to advanced simulation technology.Capabilities Proven Fiber Simulation Benchmarked Successfully High Accuracy and Resolution Flexible Seed Point Seed Curve Constraint Order of Drape Specification (Sequential) Flexible Dart Handling Instantaneous Flat Pattern Powerful Propagation Options Extensible Material Model Fully integrated in CATIA V5/V6 Compatible with Layup Technology Benefits Robust draping simulation even on complex surfaces Simulates real-world manufacturing operations Allows rapid optimization of producibility Generates flat pattern, draped pattern and fiber orientations Specifies manufacturing procedure Ensures product qualityProduct:Symulayt Advanced Fiber Modeler & Composites Link 5.23 for CATIA V5...