CAE FEA Page 160

Cast-Designer is a quick casting design and analysis tool based on upfront design & analysis technology. The core of the “upfront design & analysis technology” is to allow engineers to conduct fluid flow, heat transfer and solidification analysis by the assistance of combination of expert system and CAE technology, it helps engineers to make a “Right” engineering decision in the early design stage of a project. Upfront design & analysis technology has already been becoming a very important role in main stream design process. With Cast-Designer, users can optimize a casting design by detecting the part features with potential flow and solidification problems, evaluating gate system and overflow design alternatives in the early design stage. Even a novel with limited...

ANSYS HFSS ANSYS HFSS software is the industry-standard simulation tool for 3-D full-wave electromagnetic field simulation and is essential for the design of high-frequency and high-speed component design. HFSS offers multiple state-of the-art solver technologies based on either the proven finite element method or the well established integral equation method. You can select the appropriate solver for the type of simulation you are performing. View larger image Electric field distribution with a far field radiation pattern simulated by the new finite antenna array capability in HFSS Engineers rely on the accuracy, capacity, and performance of HFSS to design high-speed components including on-chip embedded passives, IC packages, PCB interconnects and high-frequency components such as antennas, RF/microwave components and biomedical devices. With...

ANSYS SIwave V7.0 software analyzes the printed circuit boards (PCBs) and IC packages prevalent in modern electronic products. This includes packages merged onto boards for complete channel analysis. The tool allows you to perform complete signal- and power- integrity analyses from DC to beyond 10 Gb/s. SIwave extracts frequency-dependent circuit models of signal nets and power distribution networks directly from electrical CAD layout (ECAD) databases. These analyses aid in the identification of signal- and power-integrity problems and are critical to designers seeking first-pass system success. Entire design paths from package to board to package can be analyzed using a full-wave electromagnetic simulator that realizes coupling effects between packages and boards that are often ignored. With the IC die network modeler,...

VA One : The ONE simulation environment for vibro-acoustic analysis and designAlt Text VA One is a complete solution for simulating the response of vibro -acoustic systems across the full frequency range. VA One seamlessly combines Finite Elements (FE), Boundary Elements (BEM) and Statistical Energy Analysis (SEA) in ONE model. It is the only simulation code on the market today that contains the complete spectrum of vibro-acoustic analysis methods within ONE common environment.Structural FE ModuleAlt Text Alt Text The Structural Finite Element (FE) Module of VA One contains all the functionality you need to create and work with Finite Element structural subsystems within the VA One environment. Create and solve for the response of structural FE subsystems entirely within VA...

PAM-STAMP 2G v2012 is a complete, integrated, scalable and streamlined stamping solution. It covers the entire tooling process from quotation and die design through formability and try-out validation, including springback prediction and correction. It provides solutions-oriented tools for Automotive, Aerospace, and General stamping processes.Alt TextPAM-STAMP 2G online! PAM-STAMP 2G allows users to make decisions online, bringing together the design engineer, the material provider, the die designer and the try-out press shop from an early stage of the design right through to production. This web-enabled technology allows images, annotation, text and 3D, models to be shared, thus supporting a truly collaborative engineering environment.PAM-INVERSE: Blank shape prediction Designed to make a very rapid assessment of a part shape, and to provide a...

STAR-CCM+ STAR-CCM+ provides the world\’s most comprehensive engineering simulation inside a single integrated package. Much more than just a CFD solver, STAR-CCM+ is an entire engineering process for solving problems involving flow (of fluids or solids), heat transfer and stress.STAR-CCM+ is unrivalled in its ability to tackle problems involving multi-physics and complex geometries. STAR-CCM+ has an established reputation for producing high-quality results in a single code with minimum user effort. Designed to fit easily within your existing engineering process, STAR-CCM+ helps you to entirely automate your simulation workflow and perform iterative design studies with minimal user interaction. The net result of this is that engineers get to spend more time actually analyzing engineering data and less time preparing and setting...

iveLink™ for Excel® Run COMSOL Multiphysics® simulations directly from a spreadsheet with LiveLink™ for Excel®. Parameters and variables used in COMSOL Multiphysics are instantly available in Microsoft® Excel and automatically synchronized to your physics model. LiveLink™ for Excel® allows for a simplified workflow where you only need to display and edit the most important simulation parameters. Interactive 3D visualizations are presented in a separate dedicated canvas. Using LiveLink™ for Excel® automatically adds a COMSOL® tab to the Excel ribbon for controlling the mesh or running a simulation. You can also import/export Excel files for parameter and variable lists in the COMSOL Desktop GUI. LiveLink™ for Excel® currently requires Excel 2007 or 2010 for Windows®.Learn moreLivelink™ for Excel®Here, LiveLink™ for Excel®...

The Oasys PRIMER pre-processor is designed to make preparation and modification of LS-DYNA models as fast and as simple as possible, improving user productivity and efficiency and reducing the time spent manipulating and developing models suitable for LS-DYNA.Our priority with Oasys PRIMER is to provide complete support for every LS-DYNA keyword. The user can be assured that every model read in and written out will lose no data. Main features: Full support for LS-DYNA version 971 Connections function for defining various connections (e.g. spotwelds, bolts) including a Autoweld function that does not require an input file Quick-pick menu for on-screen manipulation of entity display characteristics Quick-pick menu for on-screen editing of LS-DYNA keywords Easy access to part data through the...

NSYS Composite PrepPost Composite materials are created by combining two or more layered materials, each with different properties. These materials have become a standard for products that are both light and strong. Composites provide enough flexibility so products with complex shapes, such as boat hulls and surfboards, can be easily manufactured. Engineering layered composites involves complex definitions that include numerous layers, materials, thicknesses and orientations. The engineering challenge is to predict how well the finished product will perform under real-world working conditions. This involves considering stresses and deformations as well as a range of failure criteria. ANSYS Composite PrepPost provides all necessary functionalities for the analysis of layered composite structures.Product:Ansys Composite PrepPost 14.5 Lanaguage:english Platform:WIN32&WIN64 Size:732 MB

TOSCA Structure is the market leading technology for structural optimization based on industry standard FEA packages (ABAQUS, ANSYS, MSC NASTRAN, NX NASTRAN). It allows for rapid and reliable design of lightweight, rigid and durable components and systems. Using topology optimization with TOSCA Structure.topology you obtain optimal design proposals already during design concept. Specific detail improvements through shape and bead optimization respectively (with TOSCA Structure.shape and TOSCA Structure.bead respectively) make your designs ready for production. 123456Stress reduction through subsequent shape optimizationYour Benefit: Fast return-on-invest through use of existing simulation technology and models Performance improvement through automated layout process and closed process Innovative, directly producible, robust product proposals through exact consideration of realistic requirements Highest result quality and reliability due to integration...