Teamcenter 8 drives productivity across your global product development and manufacturing organization: * Individual and team productivity to do more with less * Application productivity for end-to-end PLM * IT productivity for greater return-on-investment Teamcenter 8 introduces a powerful new set of capabilities to increase productivity, from new Microsoft Office and Outlook integration to pre-configured IBM technology.Product:Siemens UGS Teamcenter Visualization 2007 Lanaguage:english Platform:Winxp/Win7 Size:1.51G
电路板设计解决方案市场和技术领导者Mentor Graphics宣布推出HyperLynx 7.7版，这套强大而易于使用的布局前和布局后讯号完整性仿真与分析工具包含多项生产力和技术增强功能，最适合支持PCI-Express、Hyper Transport、XAUI和SATA/SAS等最新的SERDES联机标准。 这是专门用于Mentor Graphics Vendor-Independent Flow 2006-IND2006的版本。 「 高速数字设计实用手册」(High-Speed Digital Design: A Handbook of Black Magic) 一书作者Howard Johnson博士表示：「HyperLynx 7.7新增加任意线路图编辑器和先进的高速分析功能，不但产品变得更实用，操作也更简单。所有数字设计人员都应该购买、学习和使用这套工具。」 新提供的生产力增强功能包括简单易用的「任意形状」(free-form) 传输线路编辑器，设计人员可于布局前利用它尝试各种设计 (what-if) 和发展设计约束条件，进而轻松地建立所需的SPICE和S参数模型。HyperLynx 7.7会将所有讯号损耗来源列入考虑，包括封装寄生参数、连接头和导孔损耗以及电路板的电阻性损耗和介质损耗。HyperLynx 7.7会透过一套易于使用的环境管理这些讯号完整性效应，这使其成为全世界应用最广泛的讯号完整性软件。HyperLynx 7.7版还采用Mentor Graphics独有的「导孔显示」(Via Visualizer) 技术，这对于电路板导孔的深入分析有很大帮助。其它技术增强部份还包括批次仿真、更简单的使用者界面、更多的SERDES眼形罩幕 (eye mask)、更强大的SPICE建模功能以及超过13,000种新增IBIS模型。这些增强功能都兼容于所有主要的电路板布局环境，硬件工程师可以更有效地分析10亿位等级 (multi-gigabit) 串行式电路板联机。 SERDES (SERialization/DE-Serialization) SERDES是一种快速窜红的连结技术，它能利用速率高达每秒数千兆位的串行驱动器和接收器将半导体组件和FPGA连接在一起。SERDES讯号是透过差动对传输资料，而非采用传统的宽总线架构，零件之间的资料速率最高达10 Gbps。除了资料产出大幅提升之外，SERDES还能减少电路板绕线面积、电路板厚度以及零件和连接头的接脚数。 「对许多工程师和电路布局设计人员而言，印刷电路板的SERDES联机设计与分析是一种全新概念。」Mentor Graphics副总裁暨系统设计部门总经理Henry Potts表示，「新推出的HyperLynx不但简化设计作业，还提供完整的布局前和布局后分析能力，现在将有更多使用者可以利用这种联机技术发展效能更高的系统。」 主要FPGA厂商的评论 「视讯和影像处理等应用都已采用PCI-Express等高速串行联机技术。」Altera的EDA厂商公关主管James Smith表示，「HyperLynx 7.7提供多种更强大功能，只要搭配Altera的Stratix GX设计套件就能使客户确信其系统的高速SERDES线路能够正常运作。」 「Xilinx致力为客户提供先进的连结解决方案，HyperLynx 7.7新功能使客户更容易导入我们的10Gbps RocketIO™技术。」Xilinx策略公关资深经理Jasbinder Bhoot表示，「我们与Mentor Graphics的合作很密切，这使双方共同客户得以充份利用该技术的优点。」 设计套件 为进一步推广SERDES和其它新出现的联机标准，Mentor Graphics持续与主要的半导体组件和FPGA供货商合作，共同提供更多种技术 (USB、PCI-X、DDR) 和特定半导体组件 (例如Xilinx RocketIO和Altera Stratix GX) 专用的设计套件。这些套件包含模型、参考设计和设计说明，它们让工程师能够立即以新技术展开设计工作。 支持所有主要的电路板布局工具 HyperLynx兼容于Mentor所有电路板设计流程，包括Board Station® Series、Expedition™ Series以及PADS电路板设计环境，另外它也兼容于Cadence、Altium和Zuken的电路板布局系统。 价格与供应时程 Mentor Graphics已开始供应HyperLynx 7.7版，入门版售价从4,133美元起，全功能版售价则为39,200美元。Mentor Graphics还另外提供单机使用授权 (node locked) 以及浮动授权 (floating license)。 ::::::English Description:::::: Mentor Graphics® Corporation (Nasdaq: MENT), the market and technology leader in printed circuit board (PCB) design solutions, today announced the immediate availability of HyperLynx® 7.7, the latest version of its powerful and easy-to-use tool suite for pre- and post-layout signal integrity (SI)...
::::::English Description:::::: Mentor Graphics® Corporation (Nasdaq: MENT), the market and technology leader in printed circuit board (PCB) design solutions, today announced the immediate availability of HyperLynx® 7.7, the latest version of its powerful and easy-to-use tool suite for pre- and post-layout signal integrity (SI) simulation and analysis. HyperLynx 7.7 includes significant productivity and technology enhancements targeted at classic high-speed bus technologies, as well as the rapidly emerging SERDES (SERialization/DE-Serialization) interconnect standards for connecting serial drivers and receivers. “I use HyperLynx because it is one of the few accurate circuit simulators with coupled lossy-line models and an integrated 2D field solver,” said Dr. Eric Bogatin, industry expert and author of Signal Integrity Simplified. “Plus, it is far and away the quickest...
Sonnet SUITE PRO 11.54提供面向3D平面高频电路设计系统以及在微波、毫米波领域和电磁兼容/电磁干扰设计的全套解决方案。通过提供高性能的EDA软件和专业的技术支持服务，帮助客户设计世界一流的产品。Sonnet SUITE PRO应用于平面高频电磁场分析，频率从1MHz 到几千GHz。主要的应用有：微带匹配网络 、微带电路、微带滤波器、带状线电路、带状线滤波器、过孔（层的连接或接地） 、偶合线分析、PCB板电路分析、PCB 板干扰分析、桥式螺线电感器 、平面高温超导电路分析、毫米波集成电路（ MMIC） 设计和分析 、 混合匹配的电路分析 、HDI 和LTCC 转换、 单层或多层传输线的精确分析、 多层的平面的电路分析 、单层或多层的平面天线分析 、平面天线阵分析、平面偶合孔的分析等。 定位于满足现在要求苛刻的挑战平面(3D平面)电路和天线设计人员的高频电磁设计软件. 支持microstrip, stripline, coplanar waveguide, 单多层PCB平面电路. 一、 Sonnet 软件的模块化。如同上图中看到的，Sonnet是由各种模块有机地结合在一起。包括预处理、分析求解器和后处理组成。预处理包括 dxfgeo、gds、ebridge转换模块和xgeom图形化电路编辑器；分析求解器由em和emlets组成，是软件的核心模块；后处理由emvu、patvu和emgrath三个模块组成。 二、 Sonnet提供全套集成的任务工具条 从单个的任务工具条, 你将能运行任何Sonnet程序。工作时，Sonnet任务工具条将为各模块之间提供很好的联系 。 ::::::English Description:::::: Sonnet Suite Release 11 3D Planar High-Frequency Electromagnetic Software Sonnet suites 11.54 of high-frequency electromagnetic (EM) Software are aimed at today s demanding design challenges involving predominantly planar (3D planar) circuits and antennas. Predominantly planar circuits include microstrip, stripline, coplanar waveguide, PCB (single and multiple layers) and combinations with vias, vertical metal sheets (z-directed strips), and any number of layers of metal traces embedded in stratified dielectric material. The Sonnet Suites develop precise RF models (S-, Y-, Z-parameters or extracted...
::::::English Description:::::: WELCOME TO PANTHEON, the next level for PCB/Hybrid/RF design engineering. As a complete design system, Pantheon offers in one application the same advanced features that others offer in multiple applications; geometry generation, component placement and routing, area fill, testpoints, split power planes, RF and hybrid design, and artwork creation/verification. Not only does Pantheon offer artwork creation and verification, it also offers the industry s only true double verification system in which the artwork is checked based on manufacturing rules, ensuring that the manufactured design will have zero defects. With the integration of multiple applications abilities into one highly functional application, Pantheon increases productivity to previously unreachable goals, while keeping design time and cost to a minimum. Pantheon s solid...
is the plastic injection molding simulation software, which creates the geometry totally automatically based on a stl-file. The stl-file can be exported from almost every CAD-system. With the patented 3D-F mesh (EP 1385 103) the user gets a 3D finite element framework mesh faster and more accurate than manually. Another benefit is that the system always calculates with high resolution over the wall thickness and nevertheless calculates fast. Changing the mesh over the wall thickness to produce more integration points for more accurate calculation is not necessary like in classic volume meshes.The user does not need special FE know how because the mesh manipulation is reduced on simple control functions. The 3D-F technology is developed for daily practical application. Cadmould...
::::::English Description:::::: AutoCAD® Land Desktop 2009 software supports legacy workflows for Autodesk® Land Desktop users and facilitates the transition to AutoCAD® Civil 3D® software. Microsoft Vista (32-bit) CompatibleAutoCAD® Land Desktop software is supported on the Microsoft® Windows Vista® 32-bit platform. Support for the following editions is provided: Windows Vista Enterprise, Windows Vista Business, and Windows Vista Ultimate. Product:AUTODESK AUTOCAD LAND DESKTOP 2009 Lanaguage:english Platform:Winxp/Win7 Size:3.10G
Autodesk Civil 3D是唯一能够在工程对象之间创建智能关系，从而使设计变更能够动态更新的土木工程设计工具。其增强的 3D 交互功能使用户可以轻松地建立和分析不同的设计方案，并实时更正错误，从而为用户提供了更大的设计灵活. ::::::English Description:::::: As of March 20, 2008, AutoCAD® Civil 3D® – Land Desktop Companion 2009, which is included with AutoCAD® Civil 3D® 2009 software, has been enhanced with new functionality, including support for survey analysis, grading, road modeling, pipes layout and drafting, hydrology, and hydraulics. Product:CIVIL3D LAND DESKTOP COMPANION 2009 Lanaguage:English Platform:/WinNT/2000/XP Size:1.97G
::::::English Description:::::: TurboCAD Pro 15 symbols is a precision design solution that delivers unparalleled design productivity and dramatic visual results with integrated 2D drafting, 3D surface and solid modeling, and 3D photorealistic rendering. Geometric and dimensional constraint management tools, simplified text editing and superior file format compatibility offer added power and precision. Adjustable tool palettes, context sensitive tools and intuitive work flow combine to deliver time savings. LightWorks® 7.5 and LightWorks Archives of materials and effects achieve stunning visual presentations for architectural and mechanical designs. Match lighting with real-world backgrounds to create designs with photorealistic precision. TurboCAD Pro is the most advanced CAD software in its price range. New version 14 offers over 50 new features and major improvements,...
p> ::::::English Description:::::: HyperChem is a sophisticated molecular modeling environment that is known for its quality, flexibility, and ease of use. Uniting 3D visualization and animation with quantum chemical calculations, molecular mechanics, and dynamics, HyperChem puts more molecular modeling tools at your fingertips than any other Windows program. Our newest version, HyperChem Release 8.0, is a full 32-bit application, developed for the Windows 95, 98, NT, ME, 2000, XP, and Vista operating systems. HyperChem Release 8.0 incorporates even more powerful computational chemistry tools than ever before, as well as supporting multiple third-party applications. Its drawing and rendering capabilities and ease of use are standards for the industry. Product:HyperChem 8.04 Lanaguage:english Platform:Winxp/Win7 Size:194MB